Joining materials
Introducing Pb-free solder paste, BGA balls, and flux.
We would like to introduce the "joining materials" handled by Dai Nichi Shoji Co., Ltd. The "Pb-free solder paste" comes in two types: water-washable and no-clean. The viscosity of the water-washable type is 160 Pa.s, while the no-clean type has a viscosity of 180 Pa.s. We offer two types of "BGA balls": low melting point and high melting point. For "flux," we have three types with different viscosities available. 【Main compositions (Pb-free solder paste)】 ■ Sn-Ag-Cu ■ Sn-Zn-Al(Bi) ■ Sn-Ag-Cu-Co ■ High melting point options are also available. *For more details, please refer to the PDF document or feel free to contact us.
- Company：大日商事
- Price：Other
